By Henry Shu-hung Chung, Frede Blaabjerg, Huai Wang, Michael Pecht
The most goals of strength digital converter structures (PECs) are to manage, convert, and situation electricity movement, from one shape to a different, by using solid-state electronics. This booklet outlines R&D into the clinical modelling, experimentation and remedial measures for advancing the reliability, availability, approach robustness, and maintainability of PECs at assorted degrees of complexity.
Drawing at the event of a world group of specialists, this booklet covers an advent to reliability engineering and the reliability of PECs; lifetime analysis; and robustness validation. It additionally covers functions together with low- and high-power motor drives, wind turbine structures, photovoltaic structures, uninterruptible strength offer structures, strength harvesting, energy offers for pcs, high-power converters, and automobile applications.
Reliability of strength digital Converter Systems could be of specific curiosity to pros in energy electronics, and the appliance sectors, and working towards engineers focusing on the improvement and alertness to energy digital converters and structures
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Additional resources for Reliability of power electronic converter systems
The reliability of electronic assemblies is highly dependent on the quality of the solder joints. Ghaffarian  used two-parameter Weibull distributions to fit CBGA 625 thermal cycles to failure data. 2% failure occurrence; and m is the shape parameter. 2/CV. The Coffin–Manson model predicts the number of cycles needed to drive to failure a given percentage of parts when exposed to temperature variations. 12) where Nf is the number of cycles to failure, Dt is the cycle temperature range, and d and a1 are characteristics of the material and test setup, respectively.
12. The testing procedure is as follows: 1. Identify the destruct limit of testing samples without altering the failure mechanism. Test I: reduce the stress level to 90% of destruct limit and test two parts to failure at this stress level. Test II: reduce further the stress level to 90% of that of Test I, that is, 81% of the destruct limit, and test two parts to failure at this stress level. Test III: according to the time constraints, identify the lowest possible stress level that will result in failures, and test two or more parts at this lowest stress level.
28, no. 6, pp. 3019–3027, Jun. 2013. M. Ciappa, ‘‘Selected failure mechanisms of modern power modules,’’ Journal of Microelectronics Reliability, vol. 42, no. 4–5, pp. / May 2002. L. Yang, P. A. Agyakwa, and C. M. Johnson, ‘‘Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules,’’ IEEE Transactions on Device and Materials Reliability, vol. 13, no. 1, pp. 9–17, Mar. 2013. Y. Yang, H. Wang, F. Blaabjerg, and K. Ma, ‘‘Mission profile based multidisciplinary analysis of power modules in single-phase transformerless Reliability engineering in power electronic converter systems            29 photovoltaic inverters,’’ in Proc.
Reliability of power electronic converter systems by Henry Shu-hung Chung, Frede Blaabjerg, Huai Wang, Michael Pecht